ABSTRACT: GR-1274 provides the Telcordia view of proposed minimum requirements for qualifying telecommunications printed wiring assemblies (PWAs) with regard to tolerance to hygroscopic dust found in indoor and outdoor environments.

Compliance with these generic requirements is intended to demonstrate that circuit pack performance will not significantly degrade as a result of ordinary dust contamination during use.

Issue 2:

• Discusses the main parameters influencing dust deposition such as dust concentration, maximum electric field on printed circuit boards, and cooling techniques (fan or convection)
• Applies to family designs of new technology, with the qualification test passed once for each pertinent design or new design family
• First issue in 16 years contains new and updated specifications for today's telecommunications environment.