ABSTRACT: GR-1274 provides the Telcordia view of proposed minimum requirements for qualifying telecommunications printed wiring assemblies (PWAs)
with regard to tolerance to hygroscopic dust found in indoor and outdoor
Compliance with these generic requirements is intended to demonstrate that circuit pack performance will not significantly
degrade as a result of ordinary dust contamination during use.
Discusses the main parameters influencing dust deposition such as dust concentration, maximum electric field on printed circuit
boards, and cooling techniques (fan or convection)
Applies to family designs of new technology, with the qualification test passed once for each pertinent design or new design
First issue in 16 years contains new and updated specifications for today's telecommunications environment.
Issue 2 of GR-1274, Generic Requirements for Reliability Qualification Testing of Printed Wiring Assemblies (PWAs) Exposed to
Airborne Hygroscopic Dust, replaces Issue 1. GR-1274 replaced TA-NWT-001274.
When using GR-1274, you may need to refer to GR-63. You may also want to refer to GR-78.
Components of this product are: